To keep pace with the rapidly-changing requirements, expectations and, perceptions of our customers, we continue to invest in the latest production technologies. We believe that lighter and smaller electronic products are the trend in the consumer electronic products market and envisage that the use of multi-functional PCBs with memory storage capabilities will be increasingly popular. This can be evidenced by the increasing use of flip chips in consumer electronics devices, a move of flip chip technology from its high-end niche into the mainstream IC market. We have been conducting research on other new PCB assembly technologies such as chip on flex and chip on board and on the assembly of flip-chip technology internally for a year and seek to deploy such technology in our new plant. We have adopted an advanced mounting technology which enables us to deploy the flip-chip technology in the near future. By mastering these technologies, we will be able to keep pace with our customers as they upgrade their products and it will enable us to lower our production cost.